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<i>XTREME</i> Semiconductors


Breathing New Life into Obsolescence

Increased usage of commercial integrated circuits (ICs) in long lifetime military systems (with 20 to 30yr life cycles), coupled with the steady decrease of commercial IC life cycles (typically 2-3 years), has caused component obsolescence to become an increasingly difficult aspect of managing production logistics and procurement for military systems. In many cases, due to component obsolescence, the required device packaging configuration (e.g., DIP, TSOP, SOIC, PLCC, PQFP, etc.), or bare die cannot be located, even though the product may be readily available in an alternate package footprint from the manufacturer or through distribution.

XTREME Semiconductor™ now offers a reliable, cost-effective, high or low volume Chip Recovery™ solution to remove silicon die from any plastic or ceramic package while maintaining full die functionality. The bare die is then available to be re-assembled into any available alternate plastic or hermetic package that meets the form, fit and function of the desired obsolete semiconductor product or for use in hybrid/multi-chip module applications. Chip Recovery™ solutions also provides a low-cost, quick-turn source for die required for hybrid development projects where small quantities of die are required and purchasing a full wafer or multiple wafers is not cost-effective.

Chip Recovery™ product solutions are a cost-effective alternative to other higher-cost solutions such as redesign or reverse engineering of the microcircuit chip to resolve product obsolescence issues (DMSMS). Our Chip Recovery™ solution uses chemical and mechanical processes that are no more aggressive than those used when the original die was fabricated.

The Chip Recovery™ solutions provide additional assurance in knowing that only fully inspected, authentic Original Component Manufacturer (OCM) die are re-assembled into the finished product significantly reducing the risks associated with receiving counterfeit devices.

For more information on Chip Recovery™ Product solutions or to learn how XTREME Semiconductor™ can assist you in solving your product obsolescence issues, please contact your XTREME Semiconductor™ Representative in your region.

XTREME Semiconductor™ PDF Presentations

Chip Recovery Brochure - February 2018


XTREME Semiconductor™ • 12908 Trails End Road, Suite E, Leander TX 78641 USA • 512-255-5401

© XTREME Semiconductors™. All rights reserved. Xtreme Semiconductors™ provides the following products and services to the Aerospace, Military and Defence as an aftermarket supplier of Analog-to-digital converters, Certified EOL™ products, microcircuits, high temperature products, plastic packaging, QML certified products, radiation Hardened IC's, Hi-Rel products, DMS products, custom packaging, and the prevention of Counterfeit products in the Microelectronics industry. Xtreme Semi is also involved in product assembly, die banking, lab suitability testing, replacing obsolete microcircuits, obsolete semiconductors, through-hole technology, trailing edge technology, quality conformance testing, End of life of products, semiconductor authenticity testing and as an independent distributor and aftermarket supplier